Thermal conductive glue
Thermal conductivity: > 1.2W/m-K
Curing time: 3- 5min @ 20 to 25C
Bond strength 23Kg
We have noticed that the stars 922 found online are varying from 0.6W/m-K to 1.2W/m-K.
The stuff we sell is 1.2 and has been laboratory tested and calculated to be a hair under 1.2W/m-k.
Use this VERY sparingly, for example on the RSX heat spreader of a PS3 apply an amount equivalent to a 1/2 the size of a grain of rice on each of the 5 chips.
DO NOT use this on CPU-Heatsink interfaces as the join is intended to be permanent. It will require heat in excess of 200c to degrade the adhesive to release it.
Thermal Conductive Adhesive 5g
- Product Code: Thermal Conductive Adhesive 5g
- Reward Points: 4
- Availability: In Stock
- Price in reward points: 100