95.5 Sn, 3.8 Ag, 0.7 Cu
Melting Temperature: 217°C
Excellent resistance to humidity.
Suitable for fine pitch and print speeds up to 150mm/s
Low slump, low slip and low subsidence.
High joint brightness.
CAP AND STORE OUT OF SUNLIGHT.
USE WITHIN 6 MONTHS.
10g supplied in a syringe with 20G straight precision needle. Perfect for working without stencils on BGA chips, SOIC's, SOP's without the irritation of bridged pins.
No clean RMA flux carrier system. Our paste is made in small batches and to very tight quality controls. Constantly evolving and improving! This paste is the dogs .....
Comparison video coming soon.
|Alloy Composition||62% Sn, 36% Pb, 2% Ag|
|Diameter||20 to 45 um|
|Melting Temp||217 Degrees Celcius|
|Flux Type||No Clean Humidity Resistant|
10g Precision Lead Free Solder Paste
- Product Code: 10g Precision Lead Free Solder Paste
- Reward Points: 20
- Availability: 19
- Price in reward points: 500